THERMOSETTING RESIN MATERIAL, PREPREG AND METAL SUBSTRATE

• Main Authors: WEI CHIEN-KAI, LIAO TEAO, CHANG HUNG-YI
• Format: Patent
• Language: English; Japanese
• Published: 18.01.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide a thermosetting resin material, a prepreg and a metal substrate.SOLUTION: A thermosetting resin material contains a resin composition and an inorganic filler. The resin composition contains 10-30 wt.% of polyphenylene ether resin, 40-60 wt.% of cyanate resin, and 20-40 wt.% of bismaleimid...