THERMOSETTING RESIN MATERIAL, PREPREG AND METAL SUBSTRATE

• Main Authors: WEI CHIEN-KAI, LIAO TEAO, CHANG HUNG-YI
• Format: Patent
• Language: English; Japanese
• Published: 18.01.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide a thermosetting resin material, a prepreg and a metal substrate.SOLUTION: A thermosetting resin material contains a resin composition and an inorganic filler. The resin composition contains 10-30 wt.% of polyphenylene ether resin, 40-60 wt.% of cyanate resin, and 20-40 wt.% of bismaleimide resin. The inorganic filler is surface-modified to have at least one of an acrylic group and a vinyl group.SELECTED DRAWING: Figure 1 【課題】本発明は、熱硬化性樹脂材料、プリプレグ及び金属基板を提供する。【解決手段】熱硬化性樹脂材料は、樹脂組成物及び無機フィラーを含み、樹脂組成物は、１０～３０重量％のポリフェニレンエーテル樹脂と、４０～６０重量％のシアネート樹脂と、２０～４０重量％のビスマレイミド樹脂とを含む。前記無機フィラーは、表面改質を行うことにより、アクリル基及びビニール基の中の少なくとも１つを含む。【選択図】図１