RESIN COMPOSITION FOR JOINT MATERIAL, JOINT MATERIAL, LAMINATE AND ELECTRONIC APPARATUS

To provide a joint material, a laminate and an electronic apparatus having a storage elastic modulus of 0.20 MPa or less at -20°C.SOLUTION: A joint material is obtained by using a joint material-forming composition containing a resin. The resin contains a polymer obtained by polymerizing a monomer m...

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Bibliographic Details
Main Authors MANSEI YOICHIRO, TAKAHASHI HIROAKI, TAKAHASHI RYO, ISHIKAWA EISAKU, IMAIZUMI JUNICHI
Format Patent
LanguageEnglish
Japanese
Published 18.01.2023
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
PRINTED CIRCUITS
USE OF MATERIALS AS ADHESIVES
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Summary:To provide a joint material, a laminate and an electronic apparatus having a storage elastic modulus of 0.20 MPa or less at -20°C.SOLUTION: A joint material is obtained by using a joint material-forming composition containing a resin. The resin contains a polymer obtained by polymerizing a monomer mixture containing a (meth)acryl compound. The (meth)acryl compound contains a silicone-modified (meth)acryl compound. The silicone-modified (meth)acryl compound has a molecular weight of less than 2000 g/mol.SELECTED DRAWING: Figure 1 【課題】－２０℃において０．２０ＭＰａ以下の貯蔵弾性率を有する接合材、積層体及び電子機器を提供すること。【解決手段】樹脂を含む接合材形成用組成物を用いて得られ、樹脂が、（メタ）アクリル化合物を含むモノマー混合物を重合してなる重合物を含み、（メタ）アクリル化合物がシリコーン変性（メタ）アクリル化合物を含み、シリコーン変性（メタ）アクリル化合物が、２０００ｇ／ｍｏｌ未満の分子量を有する、接合材。【選択図】図１
Bibliography:Application Number: JP20210109989