MECHANICAL QUANTITY MEASURING DEVICE

• Main Authors: YOMO HIROAKI, MIYAJIMA KENTARO
• Format: Patent
• Language: English; Japanese
• Published: 18.01.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

To improve the performance of a mechanical quantity measuring device.SOLUTION: A mechanical quantity measuring device 1 includes a semiconductor chip 2 on which a strain sensing circuit is formed, and an insulating base plate 3 on which the semiconductor chip 2 is mounted. The semiconductor chip 2 is bonded to the base plate 3 via a bonding material 5, and the bonding material 5 is preferably made of solder or metal nanoparticles. The mechanical quantity measuring device 1 is attached to an object 7 to be measured using a conductive bonding material 8. The strain generated in the object to be measured 7 is transmitted to the semiconductor chip 2 via the bonding material 8, the base plate 3, and the bonding material 5.SELECTED DRAWING: Figure 3 【課題】力学量測定装置の性能を向上させる。【解決手段】力学量測定装置１は、歪検知回路が形成された半導体チップ２と、半導体チップ２を搭載する絶縁性のベース板３と、を備えている。半導体チップ２は、接合材５を介してベース板３に接合されており、接合材５は、好ましくは半田または金属ナノ粒子からなる。力学量測定装置１は、導電性の接合材８を用いて測定対象物７に取り付けられる。測定対象物７で生じた歪は、接合材８、ベース板３および接合材５を介して半導体チップ２に伝達される。【選択図】図３