FLEXIBLE PRINTED WIRING BOARD

• Main Authors: SUGIURA TOMOHIRO, SHIMIZU HIDEHIKO
• Format: Patent
• Language: English; Japanese
• Published: 18.01.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a flexible printed wiring board which can simply suppress deterioration of reliability of a solder when mounting an electronic component.SOLUTION: A flexible printed wiring board 1 comprises: a chip component 2 as an electronic component having a first electrode 2a or the like; a base film 10; a first conductive pattern layer 11 or the like which is laminated on one part of the base film 10, and has a bonding region 11d to which the first electrode 2a is soldered as an example; and a coverlay 13 that is laminated on the base film 10 or the first pattern layer 11 or the like via an adhesive agent 14, and includes an open part 13a that exposes the one part or the like containing the bonding region 11d of the first pattern layer 11 and a chip component 2 to an external part. The first pattern layer 11 or the like includes a groove part 11c or the like that opens to a range nipped by the bonding region 11d or the like on a front surface of the pattern layer and an edge 13b of the open part 13a.SELECTED DRAWING: Figure 2A 【課題】電子部品の実装に際して、はんだ付けの信頼性の低下を簡易的に抑えるフレキシブルプリント配線板を提供する。【解決手段】フレキシブルプリント配線板１は、第１電極２ａ等を有する電子部品としてのチップ部品２と、ベースフィルム１０と、ベースフィルム１０の一部に積層され、例えば、第１電極２ａがはんだ付けされる接合領域１１ｄを有する導電性の第１パターン層１１等と、ベースフィルム１０又は第１パターン層１１等に接着剤１４を介して積層され、第１パターン層１１の接合領域１１ｄを含む一部等とチップ部品２とを外部に露出させる開口部１３ａを有するカバーレイ１３とを備える。第１パターン層１１等は、当該パターン層の表面上で接合領域１１ｄ等と開口部１３ａの縁１３ｂとで挟まれた範囲に開口する溝部１１ｃ等を有する。【選択図】図２Ａ