SUBSTRATE SUPPORT, SUBSTRATE SUPPORT ASSEMBLY AND PLASMA PROCESSING APPARATUS

• Main Author: KOIWA SHINGO
• Format: Patent
• Language: English; Japanese
• Published: 18.01.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; SEMICONDUCTOR DEVICES

To suppress the loss of RF power on the low frequency side relative to the RF power supplied to the RF electrode section in plasma processing.SOLUTION: A substrate support that supports a substrate, comprises a substrate adsorption section having adsorption electrodes for holding the substrate, an RF electrode section to which RF power is supplied, and a substrate temperature control section having heater electrodes for regulating the temperature of the substrate, and the substrate adsorption section and the substrate temperature control section are stacked across the RF electrode section.SELECTED DRAWING: Figure 3 【課題】プラズマ処理においてＲＦ電極部に供給されるＲＦ電力に対し低周波側のＲＦ電力の損失を抑制する。【解決手段】基板を支持する基板支持体であって、前記基板を保持するための吸着電極を備えた基板吸着部と、ＲＦ電力が供給されるＲＦ電極部と、前記基板の温度を調節するためのヒータ電極を備えた基板温調部と、を有し、前記基板吸着部と前記基板温調部は前記ＲＦ電極部を挟んで積層されている。【選択図】図３