SUBSTRATE PROCESSING METHOD

• Main Authors: SAWAZAKI NAOKI, SAKA SOICHIRO, NISHIMURA YUDAI, TSUKAHARA RYUTA
• Format: Patent
• Language: English; Japanese
• Published: 18.01.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To shorten the period required for substrate processing.SOLUTION: In a substrate processing method, a flow recipe including a first process recipe for setting the content of a first process to be executed on a substrate, a second process recipe for setting the content of a second process to be executed on the substrate after the first process, and a pre-recipe that sets the content of the preliminary operation for the second process recipe is preset. The first process includes discharging a first chemical solution onto the substrate, the second process includes discharging the first chemical solution onto the substrate, and the preliminary operation includes discharging the first chemical solution. The substrate processing method includes the steps of executing a first process, determining whether a period from the end of the first process to the start of the second process is shorter than a first threshold, and reducing the time of preliminary operation and executing the second process when the period from the end of the first process to the start of the second process is shorter than the first threshold.SELECTED DRAWING: Figure 16 【課題】基板処理に必要な期間を短縮すること。【解決手段】基板に対して実行される第１の処理の内容を設定する第１のプロセスレシピと、基板に対して第１の処理の後に実行される第２の処理の内容を設定する第２のプロセスレシピと、第２のプロセスレシピについての予備動作の内容を設定するプリレシピとを含むフローレシピが、予め設定される。第１の処理は基板に対する第１の薬液の吐出を含み、第２の処理は基板に対する第１の薬液の吐出を含み、予備動作は第１の薬液の排出を含む。基板処理方法は、第１の処理を実行する工程と、第１の処理の終了から第２の処理の開始までの期間が第１の閾値よりも短いか否かの判断を行う工程と、判断の結果が肯定的であれば、予備動作の時間を低減し、第２の処理を実行する工程とを備える。【選択図】図１６