SUBSTRATE PROCESSING METHOD

To suppress defects caused by a suction operation in substrate processing.SOLUTION: A substrate processing method includes a step of cleaning the inside of a suction pipe by supplying a cleaning liquid from a multiple valve to a suction pipe so as to include the multiple valve capable of selectively...

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Bibliographic Details
Main Authors TAKEMATSU YUSUKE, ISHIKAWA HIDEKAZU, ISHIMARU KEI, TSUKAHARA RYUTA
Format Patent
LanguageEnglish
Japanese
Published 17.01.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To suppress defects caused by a suction operation in substrate processing.SOLUTION: A substrate processing method includes a step of cleaning the inside of a suction pipe by supplying a cleaning liquid from a multiple valve to a suction pipe so as to include the multiple valve capable of selectively supplying at least one of a processing liquid for processing a substrate and a cleaning liquid for cleaning the substrate, a processing liquid nozzle for ejecting the processing liquid onto the substrate, a connection pipe that connects the multiple valve and the processing liquid nozzle, and a suction pipe that is branched from the connection pipe and is used to suck the inside of the connection pipe.SELECTED DRAWING: Figure 4 【課題】基板処理における吸引動作に起因する不具合を抑制する。【解決手段】基板処理方法は、少なくとも、基板を処理するための処理液と洗浄を行うための洗浄液とのうちの少なくとも一方を選択的に供給可能な多連弁と、基板に処理液を吐出するための処理液ノズルと、多連弁と処理液ノズルとを接続する接続配管と、接続配管から分岐して設けられ、かつ、接続配管内を吸引するための吸引配管とを備え、多連弁から吸引配管へ洗浄液を供給することによって吸引配管内を洗浄する工程を備える。【選択図】図４
Bibliography:Application Number: JP20210106536