SUBSTRATE FOR ELECTRONIC DEVICE, ELECTRONIC DEVICE, CHIP RESISTOR, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

To provide a substrate for an electronic device with a surface sufficiently flattened, which is superior in thermal conductivity and the adhesion between an alumina substrate and a flattened layer.SOLUTION: The substrate for the electronic device includes: an alumina substrate made of sintered body...

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Bibliographic Details
Main Authors TAKAGI NORITOSHI, SUETSUGU DAISUKE, NOGUCHI NORIMICHI, ODA HIROTAKA
Format Patent
LanguageEnglish
Japanese
Published 17.01.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRICITY
RESISTORS
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Summary:To provide a substrate for an electronic device with a surface sufficiently flattened, which is superior in thermal conductivity and the adhesion between an alumina substrate and a flattened layer.SOLUTION: The substrate for the electronic device includes: an alumina substrate made of sintered body of alumina particles; and multiple flattened layers laminated on an upper surface of the alumina substrate. At least one of the multiple flattened layers is a flattened layer containing alumina as a main component.SELECTED DRAWING: Figure 1 【課題】表面が十分平坦化されていると共に、アルミナ基板と平坦化層の密着性に優れ、熱伝導性にも優れた電子デバイス用基板を提供する。【解決手段】アルミナ粒子の焼結体からなるアルミナ基板と、前記アルミナ基板の上面に積層された、複数の平坦化層とを備え、前記複数の平坦化層のうち、少なくとも１つは、主成分がアルミナの平坦化層であることを特徴とする電子デバイス用基板。【選択図】図１
Bibliography:Application Number: JP20210106051