ELECTRONIC EQUIPMENT

To provide electronic equipment having flexibility.SOLUTION: Electronic equipment comprises: a base material; a first insulating layer arranged on the base material; a first lower electrode and a second lower electrode arranged on the first insulating layer; a second insulating layer arranged on the...

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Bibliographic Details
Main Author NISHIMURA MASUMI
Format Patent
LanguageEnglish
Japanese
Published 11.01.2023
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Summary:To provide electronic equipment having flexibility.SOLUTION: Electronic equipment comprises: a base material; a first insulating layer arranged on the base material; a first lower electrode and a second lower electrode arranged on the first insulating layer; a second insulating layer arranged on the first insulating layer, having a first opening superposed on the first lower electrode and a second opening superposed on the second lower electrode; a first organic layer arranged at the first opening, covering the first lower electrode; a second organic layer arranged at the second opening, covering the second lower electrode; a first upper electrode that covers the first organic layer; a second upper electrode that covers the second organic layer; and a sealing film that covers the first and second upper electrodes respectively. A slit penetrating through the sealing film is formed between the first upper electrode and the second upper electrode.SELECTED DRAWING: Figure 4 【課題】柔軟性をもった電子機器を提供するする。【解決手段】本実施形態の電子機器は、基材と、前記基材の上に配置された第1絶縁層と、前記第1絶縁層の上に配置された第1下部電極及び第2下部電極と、前記第1絶縁層の上に配置された第2絶縁層であって、前記第1下部電極に重畳する第1開口部と、前記第2下部電極に重畳する第2開口部と、を有する第2絶縁層と、前記第1開口部に配置され、前記第1下部電極を覆う第1有機層と、前記第2開口部に配置され、前記第2下部電極を覆う第2有機層と、前記第1有機層を覆う第1上部電極と、前記第2有機層を覆う第2上部電極と、前記第1上部電極及び前記第2上部電極をそれぞれ覆う封止膜と、を備え、前記第1上部電極と前記第2上部電極との間において、前記封止膜を貫通するスリットが形成されている。【選択図】図4
Bibliography:Application Number: JP20210103921