SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
To provide a semiconductor device comprising a wire of low electric resistance.SOLUTION: A semiconductor device comprises: a first conductive layer which extends in a first direction, includes a first face, a second face facing the first face in a second direction crossing the first direction, a thi...
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Main Authors | , , , |
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Format | Patent |
Language | English Japanese |
Published |
06.01.2023
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a semiconductor device comprising a wire of low electric resistance.SOLUTION: A semiconductor device comprises: a first conductive layer which extends in a first direction, includes a first face, a second face facing the first face in a second direction crossing the first direction, a third face and a fourth face facing the third face in a third direction crossing the first direction and the second direction and contains a first element which is at least one element selected from the group consisting of tungsten (W) and molybdenum (Mo); a first region which is provided at the side of the first face of the first conductive layer, contains a second element which is at least one element selected from the group consisting of tungsten (W) and molybdenum (Mo) and a third element which is at least one element selected from the group consisting of sulfur (S), selenium (Se) and tellurium (Te) and contains a first crystal; and a second region which is provided at the side of the second face of the first conductive layer, contains the second element and the third element and contains a second crystal.SELECTED DRAWING: Figure 3
【課題】電気抵抗の低い配線を備える半導体装置を提供する。【解決手段】実施形態の半導体装置は、第1の方向に延び、第1の面と、第1の方向と交差する第2の方向に第1の面と対向する第2の面と、第3の面と、第1の方向及び第2の方向と交差する第3の方向に第3の面と対向する第4の面とを有し、タングステン(W)及びモリブデン(Mo)からなる群から選ばれる少なくとも一つの元素である第1の元素を含む第1の導電層と、第1の導電層の第1の面の側に設けられ、タングステン(W)及びモリブデン(Mo)からなる群から選ばれる少なくとも一つの元素である第2の元素と、硫黄(S)、セレン(Se)、及びテルル(Te)からなる群から選ばれる少なくとも一つの元素である第3の元素とを含み、第1の結晶を含む第1の領域と、第1の導電層の第2の面の側に設けられ、第2の元素と第3の元素とを含み、第2の結晶を含む第2の領域と、を備える。【選択図】図3 |
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Bibliography: | Application Number: JP20210102638 |