METAL-CONTAINING FILM AND METHOD FOR MANUFACTURING METAL-CONTAINING FILM

• Main Authors: ASHIZAWA HIROAKI, AKIYAMA KOJI, TAMURA TOMOHIRO
• Format: Patent
• Language: English; Japanese
• Published: 04.01.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

To provide a metal-containing film and a method for manufacturing the metal-containing film that have good properties according to the application.SOLUTION: A metal-containing film includes a first metal-containing unit film having a thickness less than a critical crystal nucleation diameter and a second metal-containing unit film having a thickness less than the critical crystal nucleation diameter and different from the first metal-containing unit film, and the first and second metal-containing unit films are alternately laminated to form a laminate structure that does not contain grain boundaries.SELECTED DRAWING: Figure 1 【課題】用途に応じた良好な特性を有する金属含有膜および金属含有膜の製造方法を提供する。【解決手段】金属含有膜は、結晶核形成臨界直径未満の膜厚を有する第１の金属含有単位膜と、結晶核形成臨界直径未満の膜厚を有し、第１の金属含有単位膜とは異なる第２の金属含有単位膜とが、交互に積層されてなり、結晶粒界を含まないラミネート構造を有する。【選択図】図１