TRANSPORT TRAY, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MANUFACTURING DEVICE FOR SEMICONDUCTOR DEVICE

• Main Authors: YOKOYAMA TAKESHI, SANO SHINJI, SEKI TOMONORI, MIYAZAWA YOSUKE, TAKIZAWA NAOKI
• Format: Patent
• Language: English; Japanese
• Published: 28.12.2022
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS,IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KINDOF FURNACE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FURNACES; HEATING; KILNS; LIGHTING; MACHINE TOOLS; MECHANICAL ENGINEERING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OVENS; PERFORMING OPERATIONS; RETORTS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WEAPONS; WELDING; WORKING BY LASER BEAM

To suppress a variation in the quality of a group of products manufactured using a transport tray.SOLUTION: A transport tray 1 includes a group of piece trays 20 and a frame 10. Each of the piece trays 20 has a tray portion 21 and an ear portion 22 with a lower end 24 positioned higher than its back surface 23. The frame 10 includes an upper surface 11, a lower surface 12, and a contact portion 11a that can abut against the lower ends 24 of the ear portions 22 when the tray portion 21 is arranged inside an opening portion 14. The height from the lower surface 12 of the frame 10 to the contact portion 11a is lower than the height from the rear surface 23 of the tray portion 21 to the lower end 24 of the ear portion 22. Even when there is a gap 400 between the lower surface 12 of the frame 10 and an installation surface 321 of a cooling plate 320, the tray portion 21 is displaced and the back surface 23 contacts the installation surface 321. Variations in solder cooling rate and occurrence of shrinkage cavities in bonding layers 220 and 240 of a processing targets 200 group mounted on the transport tray 1 are suppressed, and variations in the quality of an obtained product group are suppressed.SELECTED DRAWING: Figure 12 【課題】搬送トレイを用いて製造される製品群の品質のばらつきを抑える。【解決手段】搬送トレイ１は、個片トレイ２０群及び枠１０を含む。各個片トレイ２０は、トレイ部２１、及びその裏面２３よりも下端２４が高い位置にある耳部２２を有する。枠１０は、上面１１及び下面１２と、トレイ部２１が開口部１４の内部に配置された状態で耳部２２の下端２４に当接可能な当接部１１ａとを有する。枠１０の下面１２から当接部１１ａまでの高さは、トレイ部２１の裏面２３から耳部２２の下端２４までの高さよりも低い。枠１０の下面１２と冷却板３２０の設置面３２１との間にギャップ４００があっても、トレイ部２１が変位し、裏面２３が設置面３２１と接触する。搬送トレイ１に搭載される処理対象２００群の接合層２２０，２４０の半田の冷却速度のばらつき、引け巣の発生を抑え、得られる製品群の品質のばらつきを抑える。【選択図】図１２