LAMINATE AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: SHIRAGA JUN, FUKAZAWA NORIMASA, FURUYA TOSHITAKE, FUJIKAWA WATARU
• Format: Patent
• Language: English; Japanese
• Published: 27.12.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

To provide a laminate which has a smooth interface between an insulating base material having a thermoplastic resin on an outermost surface layer and a metal layer formed on the insulating base material, and has excellent adhesion between the insulator and the metal layer, a method for manufacturing the same, and a printed wiring board manufactured using the laminate.SOLUTION: The inventors have found out a laminate having excellent adhesion by using a laminate in which a thermoplastic resin layer (B), a primer layer (C) and a metal layer (D) are laminated sequentially on an insulating base material (A).SELECTED DRAWING: None 【課題】熱可塑性樹脂を最表層に有する絶縁性基材と、その上に形成された金属層との界面が平滑で、かつ、絶縁体－金属層間の密着性に優れた積層体、およびその製造方法、ならびに、当該積層体を用いて製造されるプリンと配線板を提供する。【解決手段】絶縁性基材（Ａ）の上に、熱可塑性樹脂層（Ｂ）、プライマー層（Ｃ）、及び金属層（Ｄ）が順次積層されたものであることを特徴とする積層体を用いることで、密着性の優れた積層体を見出したものである。【選択図】なし