RESIN MOLDING MATERIAL, MOLDING AND METHOD FOR MANUFACTURING THE MOLDING

• Main Author: YAMASHITA KATSUSHI
• Format: Patent
• Language: English; Japanese
• Published: 19.12.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRICITY; INDUCTANCES; MAGNETS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSFORMERS; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a resin molding material which is excellent in filling property into a mold and is excellent in moldability.SOLUTION: A resin molding material contains (A) soft magnetic particles, (B) a thermosetting resin, and (C) a phenolic curing agent, and has an average value between the following maximum diameter measured under the following condition and the following minimum diameter passing through a center of the maximum diameter of 45 cm or more and 95 cm or less. (Condition) A resin molding material of a cup of a measuring part of a measuring spoon having a measuring part (opening diameter: 18.4 mm, depth: 9 mm, and volume: 2.0 ml) having a semi-elliptic cross section is placed on a hot plate (material: SKD11) at 175°C by the measuring spoon. A mold heated at 175°C (material: SKD11, dimension: 180 mm×150 mm×thickness of 15 mm, and weight: 3 kg) is placed on the resin molding material within 10 seconds after the resin molding material so as to be parallel to the upper surface of the hot plate, and is left for 5 minutes. The mold is removed, a maximum diameter of the resin molding material expanded in a substantially circular shape and a minimum value passing through the center of the maximum value are measured.SELECTED DRAWING: Figure 1 【課題】金型内への充填性に優れ、成形性に優れた樹脂成形材料を提供する。【解決手段】（Ａ）軟磁性粒子、（Ｂ）熱硬化性樹脂、および（Ｃ）フェノール系硬化剤を含み、以下の条件で測定された下記最大径と当該最大径の中心を通る下記最小径の平均値が４５ｃｍ以上９５ｃｍ以下である、樹脂成形材料とする。（条件）１７５℃の熱板（材質：ＳＫＤ１１）上に、断面半楕円形状の計量部（開口直径：１８．４ｍｍ、深さ：９ｍｍ、容積：２．０ｍｌ）を備える計量スプーンで、計量部の摺り切り一杯分の樹脂成形材料を置く。樹脂成形材料を載置してから１０秒以内に樹脂成形材料の上に、１７５℃に加熱した金型（材質：ＳＫＤ１１、寸法：１８０ｍｍ×１５０ｍｍ×厚み１５ｍｍ、重量：３ｋｇ）を熱板の上面と平行となるように載せ、５分間放置する。金型を取り除き、略円形に押し広げられた樹脂成形材料の最大径と当該最大径の中心を通る最小径を測定する。【選択図】図１