FLEXIBLE SUBSTRATE

To provide a flexible substrate that can suppress unevenness formation of a conductor layer at bending points.SOLUTION: A flexible substrate 10 has a laminate 1 and a regulator 2. The laminate 1 has one or more insulating base materials 11 and one or more conductor layers 12. The laminate 1 has a lo...

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Bibliographic Details
Main Author AWAJI DAISUKE
Format Patent
LanguageEnglish
Japanese
Published 15.12.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:To provide a flexible substrate that can suppress unevenness formation of a conductor layer at bending points.SOLUTION: A flexible substrate 10 has a laminate 1 and a regulator 2. The laminate 1 has one or more insulating base materials 11 and one or more conductor layers 12. The laminate 1 has a looped folded portion 15 and an opposing region 16 facing each other by being folded at the folded portion 15. The regulator 2 is provided inside the folded portion 15 and regulates the bending inner diameter L2 of the folded portion 15. The bending inner diameter L2 is larger than the distance L1 between the laminates 1 in the facing regions 16.SELECTED DRAWING: Figure 1 【課題】曲げ箇所における導体層の凹凸形成を抑制できるフレキシブル基板を提供する。【解決手段】フレキシブル基板１０は、積層体１と、規制体２と、を備える。積層体１は、１または複数の絶縁基材１１と、１または複数の導体層１２とを備える。積層体１は、ループ状に折り返された折曲げ部１５と、折曲げ部１５で折り返されることによって向かい合う対向領域１６と、を有する。規制体２は、折曲げ部１５の内側に設けられ、折曲げ部１５の曲げ内径Ｌ２を規制する。曲げ内径Ｌ２は、対向領域１６における積層体１どうしの距離Ｌ１より大きい。【選択図】図１
Bibliography:Application Number: JP20210094239