LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

• Main Authors: OGIWARA TAKAFUMI, JOAN HAYATE
• Format: Patent
• Language: English; Japanese
• Published: 08.12.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

To improve laser processing precision in a laser processing device that forms multiple rows of modification regions for division in a semiconductor substrate.SOLUTION: A laser processing device comprises a laser irradiation unit 3 and a control part 8. The control part 8 is configured to execute: first control for controlling the laser irradiation unit 3 so that modification regions for division are formed along each line extending in an X direction, and a crack 14 extends in a direction of a surface 21a from the modification regions 12a, b; second control for controlling the laser irradiation unit 3 so that after the first control, the modification regions for division are formed along each of a plurality of lines in a Y direction, and the crack 14 extends in the direction of the surface 21a from the modification regions; and third control for controlling the laser irradiation unit 3 so that before the second control, the crack 14 extending from a plurality of modification regions for warpage suppression reaches a rear face 21b and is formed discontinuously to the crack 14 extending from the modification regions for division.SELECTED DRAWING: Figure 4 【課題】半導体基板の内部に複数列の分割用の改質領域を形成するレーザ加工装置において、レーザ加工精度を向上させること。【解決手段】レーザ加工装置は、レーザ照射ユニット３と制御部８とを備え、制御部８は、Ｘ方向に延びるラインのそれぞれに沿って、分割用の改質領域が形成され該改質領域１２ａ，ｂから表面２１ａ方向に亀裂１４が延びるようにレーザ照射ユニット３を制御する第１制御と、第１制御後において、Ｙ方向に複数のラインのそれぞれに沿って、分割用の改質領域が形成され改質領域から表面２１ａ方向に亀裂１４が延びるようにレーザ照射ユニット３を制御する第２制御と、第２制御前において、反り抑制用の複数の改質領域から延びる亀裂１４が、裏面２１ｂに到達すると共に分割用の改質領域から延びる亀裂１４に連続せずに形成されるように、レーザ照射ユニット３を制御する第３制御と、を実行するように構成されている。【選択図】図４