LAMINATED COIL COMPONENT
To provide a laminated coil component which has a compact constitution, and in which desired inductance is ensured and the occurrence of stray capacity can be suppressed.SOLUTION: In a laminated coil component 1, first and second terminal electrodes 5 and 6 are electrically connected to each other t...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
06.12.2022
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a laminated coil component which has a compact constitution, and in which desired inductance is ensured and the occurrence of stray capacity can be suppressed.SOLUTION: In a laminated coil component 1, first and second terminal electrodes 5 and 6 are electrically connected to each other through a coil 10. First and second inner conductor layers 15a and 15b are positioned at an outermost position among a plurality of inner conductor layers 15 in a lamination direction D3. A third inner conductor layer 15c is sandwiched between the first and the second inner conductor layer 15a and 15b. The third inner conductor layer 15c is electrically connected to the first terminal electrode 5 through the first inner conductor layer 15a and to the second terminal electrode 6 through the second inner conductor layer 15b. The third inner conductor layer 15c overlaps the second terminal electrode 6 when viewed from the lamination direction D3. The first inner conductor layer 15a and a via 17a connected to the first inner conductor layer 15a do not overlap the second terminal electrode 6 when viewed from the lamination direction D3.SELECTED DRAWING: Figure 3
【課題】コンパクトな構成で、所望のインダクタンスが確保されていると共に浮遊容量の発生が抑制され得る積層コイル部品を提供する。【解決手段】積層コイル部品1において、第一、第二端子電極5、6は、コイル10を介して互いに電気的に接続されている。第一、第二内部導体層15a、15bは、上記複数の内部導体層15のうち積層方向D3において最も外側に位置する。第三内部導体層15cは、第一、第二内部導体層15a、15bに挟まれている。第三内部導体層15cは、第一内部導体層15aを介して第一端子電極5に電気的に接続されており、第二内部導体層15bを介して第二端子電極6に電気的に接続されている。第三内部導体層15cは、積層方向D3から見て、第二端子電極6と重なっている。第一内部導体層15a及び第一内部導体層15aに連結されているビア17aは、積層方向D3から見て、第二端子電極6と重ならない。【選択図】図3 |
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Bibliography: | Application Number: JP20210086964 |