DICING DIE-BONDING FILM

• Main Authors: SUGIMURA TOSHIMASA, ONISHI KENJI, SUMINO MASATOSHI, FUKUI AKIHIRO, KIMURA TAKEHIRO
• Format: Patent
• Language: English; Japanese
• Published: 02.12.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

To provide a dicing die-bonding film exhibiting chip float suppression performance and excellent pickup performance.SOLUTION: There is provided a dicing die-bonding film including a dicing tape having an adhesive base material layer and an adhesive layer overlaid on the base material layer, and a die-bonding sheet overlaid on the dicing tape. The adhesive layer has a phase separation structure when a cross section of the adhesive layer is observed with an electron microscope. The phase separation structure includes a first phase containing a radical polymerizable carbon-carbon double bond, and a second phase separated from the first phase, the second phase having a content of the radical polymerizable carbon-carbon double bond lower than that of the first phase, the area ratio of the first phase in the cross section being higher than 50%.SELECTED DRAWING: Figure 1 【課題】 チップ浮きの抑制性能と良好なピックアップ性とを有するダイシングダイボンドフィルムを提供することを課題としている。【解決手段】 粘基材層、及び、該基材層に重なった粘着剤層を有するダイシングテープと、該ダイシングテープに重ねられたダイボンドシートとを備え、前記粘着剤層は、電子顕微鏡によって断面を観察したときに、相分離構造を有し、前記相分離構造は、ラジカル重合性炭素－炭素二重結合を含有する第１相と、該第１相よりもラジカル重合性炭素－炭素二重結合の含有率が低く前記第１相と分離した第２相とを含み、前記断面における前記第１相の面積割合が５０％よりも高いダイシングダイボンドフィルムを提供する。【選択図】 図１