SUPERCONDUCTING DEVICE
To provide a superconducting device capable of suppressing disconnection of a terminal connected to the outside and securing a terminal connected to the outside.SOLUTION: A superconducting device according to an embodiment includes a superconducting chip 10, an interposer 20 on which the superconduc...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
30.11.2022
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a superconducting device capable of suppressing disconnection of a terminal connected to the outside and securing a terminal connected to the outside.SOLUTION: A superconducting device according to an embodiment includes a superconducting chip 10, an interposer 20 on which the superconducting chip 10 is mounted, a socket 40 disposed opposite the interposer 20, and including a movable pin 47 and a housing 45 supporting the movable pin 47, and a board 50 arranged to face the socket 40 and formed with a connector for external input/output, and in the board 50, one end of the terminal of a via hole 52 is electrically connected to one end of the terminal of the movable pin 47, and the hole diameter of the via hole 52 is smaller than the diameter of the tip of movable pin 47 connected to the via hole.SELECTED DRAWING: Figure 1
【課題】外部へ接続する端子の断線を抑制し、外部へ接続する端子を確保することができる超伝導デバイスを提供する。【解決手段】一実施の形態に係る超伝導デバイスは、超伝導チップ10と、超伝導チップ10が実装されたインターポーザ20と、インターポーザ20に対向して配置され、可動ピン47及び可動ピン47を支持するハウジング45を含むソケット40と、ソケット40に対向して配置され、外部への入出力となるコネクタが形成されたボード50を備え、ボード50は、ビアホール52の端子の一端が可動ピン47の端子の一端と電気的に接続すると共に、ビアホール52の穴径が、ビアホールに接続する可動ピン47の先端部分の直径より小さい。【選択図】図1 |
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Bibliography: | Application Number: JP20210082873 |