RESIN COMPOSITION, CURED MATERIAL, SEMICONDUCTOR SEALING MATERIAL, AND SEMICONDUCTOR DEVICE

• Main Authors: AOYAMA KAZUMASA, AKIMOTO GENSUKE, YAMOTO KAZUHISA
• Format: Patent
• Language: English; Japanese
• Published: 25.11.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide: a resin composition that can contribute to obtaining a cured material excellent in low elastic modulus and high toughness; a cured material and a semiconductor sealing material that are obtained using the resin composition; and a semiconductor device including the cured material that is...