RESIN COMPOSITION, CURED MATERIAL, SEMICONDUCTOR SEALING MATERIAL, AND SEMICONDUCTOR DEVICE

• Main Authors: AOYAMA KAZUMASA, AKIMOTO GENSUKE, YAMOTO KAZUHISA
• Format: Patent
• Language: English; Japanese
• Published: 25.11.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide: a resin composition that can contribute to obtaining a cured material excellent in low elastic modulus and high toughness; a cured material and a semiconductor sealing material that are obtained using the resin composition; and a semiconductor device including the cured material that is obtained using the semiconductor sealing material.SOLUTION: The present invention relates to a resin composition comprising a p-t-butylphenol novolac type epoxy resin (A) and an epoxy resin (B) having a dicyclopentadiene skeleton.SELECTED DRAWING: None 【課題】低弾性率や、高靱性に優れる硬化物を得るために寄与できる樹脂組成物、前記樹脂組成物を用いて得られる硬化物や半導体封止材、前記半導体封止材を用いて得られた硬化物を含む半導体装置を提供することにある。【解決手段】本発明は、パラターシャリーブチルフェノールノボラック型エポキシ樹脂（Ａ）、及び、ジシクロペンタジエン骨格を有するエポキシ樹脂（Ｂ）を含有することを特徴とする樹脂組成物に関する。【選択図】なし