COMPOSITE FILM, LID MATERIAL, AND CONTENT-STORED CONTAINER WITH LID

To provide a composite film capable of suppressing remaining of a film formed by an adhesive layer and a heat seal layer in a resealed part even in unsealing under a low-temperature environment when a package heat-sealed to be resealable is formed, a lid material formed from the composite film, and...

Full description

Saved in:
Bibliographic Details
Main Authors TANIGAWA RYOJI, ONO SHIORI, YOSHIMURA SEIGO
Format Patent
LanguageEnglish
Japanese
Published 25.11.2022
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:To provide a composite film capable of suppressing remaining of a film formed by an adhesive layer and a heat seal layer in a resealed part even in unsealing under a low-temperature environment when a package heat-sealed to be resealable is formed, a lid material formed from the composite film, and a content-stored container with a lid.SOLUTION: A composite film 10 comprises a base material layer, an adhesive layer 4, and a heat seal layer 5 in this order. The base material layer and the heat seal layer are bonded to each other via the adhesive layer. The adhesive layer includes a thermoplastic elastomer and a rosin ester, and the heat seal layer includes a polyethylene resin.SELECTED DRAWING: Figure 1 【課題】ヒートシールして再封可能な包装体を形成したときに、低温環境下における開封においても、再封部に粘着層及びヒートシール層からなる膜の残留を抑制できる、複合フィルム、当該複合フィルムから形成された蓋材、及び内容物入り蓋付容器を提供する。【解決手段】複合フィルム10は、基材層、粘着層4、及びヒートシール層5を、この順で含み、前記基材層と前記ヒートシール層とは、前記粘着層によって互いに接着されており、前記粘着層は、熱可塑性エラストマーとロジンエステルとを含み、かつ前記ヒートシール層は、ポリエチレン樹脂を含む。【選択図】図1
Bibliography:Application Number: JP20210082396