ELECTRONIC APPARATUS

To provide means capable of achieving at least one of the minimization of a dead space in fixing a heat sink to a substrate and the minimization of a cost increase due to heat sink processing.SOLUTION: An electronic apparatus includes: a substrate 1; an IC 4 provided on the substrate 1; a heat sink...

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Bibliographic Details
Main Author MATSUMOTO KAZUMI
Format Patent
LanguageEnglish
Japanese
Published 18.11.2022
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:To provide means capable of achieving at least one of the minimization of a dead space in fixing a heat sink to a substrate and the minimization of a cost increase due to heat sink processing.SOLUTION: An electronic apparatus includes: a substrate 1; an IC 4 provided on the substrate 1; a heat sink 2 for dissipating heat emitted from the IC 4; and a holder 3 holding the heat sink 2 such that the protrusion 2c of the heat sink 2 is exposed. The holder 3 is mounted on the substrate 1 such that the protrusion 2c of the heat sink 2 is located on the IC 4.SELECTED DRAWING: Figure 2 【課題】ヒートシンクの基板への固定におけるデッドスペースの最小化、及び、ヒートシンクの加工によるコストアップの最小化の少なくともいずれかを可能とする手段を提供すること。【解決手段】電子機器は、基板１と、基板１上に設けられたＩＣ４と、ＩＣ４から発せられる熱を放熱するためのヒートシンク２と、ヒートシンク２の突出部２ｃが露出するように、ヒートシンク２を保持するホルダー３と、を備える。ホルダー３は、ヒートシンク２の突出部２ｃが、ＩＣ４上に位置するように、基板１上に取り付けられている。【選択図】図２
Bibliography:Application Number: JP20210079390