MULTILAYER WIRING BOARD, COMPOSITE WIRING BOARD, PACKAGED DEVICE, AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

• Main Authors: TANABE MASATO, TSUCHIDA TETSUYUKI
• Format: Patent
• Language: English; Japanese
• Published: 10.11.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To provide a multilayer wiring board having high insulation reliability, a composite wiring board, a packaged device, and a method for manufacturing a multilayer wiring board.SOLUTION: Layers 70 and 80 of a multilayer wiring board 12 include: insulating resin layers 71 and 81 which are provided with recesses 75 and 85 for lands opened in first surfaces 71a and 81a, groove parts 74 and 84 opened in the first surfaces 71a and 81a, and recesses 76 and 86 for vias that are opened in second surfaces 71b and 81b, in which the one or more recesses communicate with the recesses 75 and 85 for the lands, and are integrally formed in a thickness direction; and inorganic insulating layers 300 and 310 which include first parts 301 and 311 covering the first surfaces 71a and 81a, second parts 302 and 312 covering bottom surfaces 74b and 84b of groove parts 74 and 84, and third parts 303 and 313 covering bottom surfaces 75b and 85b of the recesses 75 and 85 for the lands, wherein the first parts 301 and 311 are thicker than the second parts 302 and 312 and the third parts 303 and 313.SELECTED DRAWING: Figure 2 【課題】絶縁信頼性に優れた多層配線基板、複合配線基板、パッケージ化デバイス、及び多層配線基板の製造方法を提供すること。【解決手段】多層配線基板１２の層７０、８０の各々は、第１面７１ａ、８１ａで開口したランド用凹部７５、８５、第１面７１ａ、８１ａで開口した溝部７４、８４、及び、第２面７１ｂ、８１ｂで開口し、ランド用凹部７５、８５の１以上と連通したビア用凹部７６、８６が設けられた絶縁樹脂層７１、８１と、第１面７１ａ、８１ａを被覆した第１部分３０１、３１１と、溝部７４、８４の底面７４ｂ、８４ｂを被覆した第２部分３０２、３１２と、ランド用凹部７５、８５の底面７５ｂ、８５ｂを被覆した第３部分３０３、３１３とを含み、第１部分３０１、３１１は、第２部分３０２、３１２及び第３部分３０３、３１３と比較してより厚い無機絶縁層３００、３１０と、を含む。【選択図】図２