ADHESIVE COMPOSITION, ADHESIVE FILM, AND METHOD FOR PRODUCING CONNECTION STRUCTURE

• Main Authors: YOSHIBA AYUMI, IZAWA HIROYUKI, OKOSHI SHOJI
• Format: Patent
• Language: English; Japanese
• Published: 08.11.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; PRINTED CIRCUITS; USE OF MATERIALS AS ADHESIVES

To provide an adhesive composition including a polyurethane imide resin having excellent methyl ethyl ketone (MEK) solubility while having a diphenylmethane-4,4'-diisocyanate(4, 4'-MDI)-derived structure and an adhesive film, and a method for producing a connection structure using the adhesive film.SOLUTION: An adhesive composition includes a polyurethane imide resin as a block copolymer comprising a polyurethane oligomer from the reaction between a diisocyanate and a diol, which is chain-extended with a tetracarboxylic acid dianhydride. Relative to 100 pts.mass of the polyurethane imide resin, the methyl ethyl ketone is 1-1000 pts.mass.SELECTED DRAWING: None 【課題】ジフェニルメタン－４，４'－ジイソシアネート（４、４'－ＭＤＩ）由来の構造を有しながらもメチルエチルケトン（ＭＥＫ）溶解性に優れたポリウレタンイミド樹脂を含む接着剤組成物及び接着剤フィルム、並びに接着剤フィルムを用いる接続構造体の製造方法を提供する。【解決手段】接着剤組成物は、ジイソシアネートとジオールとの反応から得られたポリウレタンオリゴマを、テトラカルボン酸二無水物で鎖延長したブロック共重合体であるポリウレタンイミド樹脂を含み、前記ポリウレタンイミド樹脂１００質量部に対して、メチルエチルケトンを１～１０００質量部含有する。【選択図】なし