WIRING BOARD AND MANUFACTURING METHOD THEREOF

• Main Authors: ADACHI TAKEMA, MINOURA DAISUKE
• Format: Patent
• Language: English; Japanese
• Published: 27.10.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To improve the quality of a wiring board.SOLUTION: A wiring board 100 includes: a first conductor layer 11; an insulating layer 22 formed on the first conductor layer 11; a second conductor layer formed on the insulating layer 22; a connection conductor 4 that penetrates the insulating layer 22 and connects the first conductor layer 11 and the second conductor layer; and a coating film 5 formed on the surface of the first conductor layer 11 and improving adhesion between the first conductor layer 11 and the insulating layer 22. The first conductor layer 11 includes a conductor pad 1a in contact with the connection conductor 4, and a surface 1a0 of the conductor pad 1a on the second conductor layer side has a first region 1aa and a second region 1ab having surface roughnesses different from each other, and the first region 1aa is covered with the coating film 5, and the second region 1ab is covered with the connection conductor 4.SELECTED DRAWING: Figure 3 【課題】配線基板の品質向上。【解決手段】実施形態の配線基板１００は、第１導体層１１と、第１導体層１１の上に形成されている絶縁層２２と、絶縁層２２の上に形成されている第２導体層と、絶縁層２２を貫通して第１導体層１１と第２導体層とを接続する接続導体４と、第１導体層１１の表面に形成されていて第１導体層１１と絶縁層２２との密着性を向上させる被覆膜５と、を備えている。第１導体層１１は、接続導体４と接する導体パッド１ａを含み、導体パッド１ａにおける第２導体層側の表面１ａ０は、互いに異なる面粗度を有する第１領域１ａａと第２領域１ａｂとを有し、第１領域１ａａは被覆膜５に覆われており、第２領域１ａｂは接続導体４に覆われている。【選択図】図３