MANUFACTURING METHOD OF RESIN SUBSTRATE

• Main Authors: SHIBATA SHINJI, SHIMONO SHINICHI
• Format: Patent
• Language: English; Japanese
• Published: 26.10.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide a manufacturing method of a resin substrate capable of finely adjusting the thickness of a thin plate portion according to the vibration resistance characteristics of a mounted component in a resin substrate for suppressing vibration to a mounted element due to vibration during cutting work of a joint portion.SOLUTION: A manufacturing method of a resin substrate 100 according to an aspect of the present invention in which a product substrate 1 on which an electronic component including one or more target elements E whose vibration suppression is required is mounted and a discarded substrate 3 to be cut and removed after being used for work are physically bonded through a joint portion 2 includes a preparation step of preparing a primary substrate in which the product substrate 1, the discarded substrate 2 and the joint portion 3 are formed with the same thickness, and a thinning step of scraping off the surface of the joint portion 2 on at least one surface of the primary substrate to reduce the thickness of the joint portion 2 to a predetermined value.SELECTED DRAWING: Figure 2 【課題】接合部の切断作業時の振動による実装素子への振動を抑制する樹脂基板において、実装部品の耐振動特性に応じて薄板部の厚さを細かく調整可能な樹脂基板の製造方法を提供する。【解決手段】本発明の一態様は、振動の抑制が要求される一つ以上の対象素子Ｅを含む電子部品が実装される製品基板１と、作業用に使用された後に切断除去される捨て基板３とが接合部２を介して部分的に結合された樹脂基板１００の製造方法であって、製品基板１、捨て基板２および接合部３が同じ厚さで形成された一次基板を準備する準備工程と、当該一次基板の少なくとも一方の面において接合部２の表面を削り取る加工を行い、接合部２の厚さを所定値まで薄くする薄板化工程とを含む。【選択図】図２