SUBSTRATE PROCESSING DEVICE

To provide a substrate processing device capable of preventing hot air emitted from a dump from being transmitted to light radiated toward a substrate.SOLUTION: There is provided a substrate processing device including: a chamber to accommodate a substrate inside; a light source to radiate light ont...

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Bibliographic Details
Main Authors LEE HYEUNG JIN, CHOI DONG GYU, IM MIN JUN, UM TAE JUN, KIM DAE YOU
Format Patent
LanguageEnglish
Japanese
Published 24.10.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a substrate processing device capable of preventing hot air emitted from a dump from being transmitted to light radiated toward a substrate.SOLUTION: There is provided a substrate processing device including: a chamber to accommodate a substrate inside; a light source to radiate light onto the substrate; a cutter arranged in the path of radiated light so as to block at least part of radiated light; a dump for allowing light reflected from the substrate or light reflected from the cutter to enter inside the dump to be cancelled; and a mirror block allowing light reflected from at least one of the substrate and the cutter to enter the dump, the mirror block being arranged between the path of the light and the dump.SELECTED DRAWING: Figure 1 【課題】基板に向かって照射される光にダンプから発せられた熱気が伝えられてしまうことを抑えることのできる基板処理装置を提供すること。【解決手段】内部に基板を収容するチャンバーと、前記基板に光を照射する光源と、照射された光の少なくとも一部を遮断するように、照射された光の経路に配置されるカッターと、前記基板から反射された光又は前記カッターから反射された光を内部に入射させて打ち消すためのダンプと、前記基板及び前記カッターのうちの少なくともどちらか一方から反射された光を前記ダンプに入射させ、前記光の経路と前記ダンプとの間に配設されるミラーブロックと、を備える基板処理装置。【選択図】図１
Bibliography:Application Number: JP20220063513