POLISHING SHEET

To provide a polishing sheet which can reduce average surface roughness of a polishing object even when a polishing rate is increased, and can achieve both a high polishing rate and surface polishing property at high levels, and to provide a polishing sheet which prevents generation of damage due to...

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Bibliographic Details
Main Authors WATANABE NANAMI, YAMASHITA MIU, AIKAWA FUMITO, SATO MAKOTO
Format Patent
LanguageEnglish
Japanese
Published 21.10.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GRINDING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:To provide a polishing sheet which can reduce average surface roughness of a polishing object even when a polishing rate is increased, and can achieve both a high polishing rate and surface polishing property at high levels, and to provide a polishing sheet which prevents generation of damage due to heat generation and mechanical stress, and has high heat resistance and high durability.SOLUTION: A polishing sheet has a polishing layer in which polishing material particles are immobilized on a flexible base material, and contains a polyphenylene sulfide resin as the flexible base material.SELECTED DRAWING: Figure 1 【課題】研磨レートを高くしても研磨対象物の平均表面粗さを低減でき、高研磨レート及び表面研磨性を高いレベルで両立することができる研磨シートを提供する。さらに、発熱や機械的ストレスによる損傷等が生じ難く、高耐熱・高耐久性を有する研磨シートを提供する。【解決手段】可撓性基材上に、研磨材粒子が固定化されてなる研磨層を有する研磨シートにおいて、該可撓性基材として、ポリフェニレンサルファイド樹脂が含まれていることを特徴とする研磨シート。【選択図】図１
Bibliography:Application Number: JP20210066638