BUILDING EXTENSION METHOD

To provide a building extension method excellent at workability with which the number of exterior wall panels to be removed can be reduced as much as possible when constructing an extension part below a girth in an existing building where the outer wall panels protrude in front of the girth located...

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Bibliographic Details
Main Authors OYAMA MAKOTO, NOMURA TOMOFUMI, TSUJIMOTO MASASHI, IMAHASHI YURINA
Format Patent
LanguageEnglish
Japanese
Published 14.10.2022
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Summary:To provide a building extension method excellent at workability with which the number of exterior wall panels to be removed can be reduced as much as possible when constructing an extension part below a girth in an existing building where the outer wall panels protrude in front of the girth located therebelow.SOLUTION: Provided is a building extension method for removing a part of an outer wall 110 of a multi-story existing building 100 and extending it. The existing building 100 has outer wall panels 40A, 40B on an upper floor and a lower floor, respectively. The outer wall panel 40A on the upper floor protrudes in front of a girth 10A between the upper and lower floors. When carrying out extension on the outdoor side of the lower floor of the existing building 100, there are a process A of exposing a part of the girth 10A by cutting the outer wall panels 40A at least halfway in a height of the girth 10A of the outer wall panel 40A on the upper floor and reinforcing a cut part 40a, and a process B of connecting a ceiling beam 90 to the exposed girth 10A so as to construct an extension part 200.SELECTED DRAWING: Figure 7 【課題】外壁パネルがその下方にある胴差しの前面に張り出している既設建物において、当該胴差しの下方に増築部を施工するに当たり、取り外し対象の外壁パネルの数を可及的に低減でき、施工性に優れた建物の増築方法を提供すること。【解決手段】複数階の既設建物100の外壁110の一部を撤去して増築する、建物の増築方法であり、既設建物100は、上階と下階に外壁パネル40A,40Bを備え、上階の外壁パネル40Aは上階と下階の間の胴差し10Aの前面に張り出しており、既設建物100の下階の屋外側に増築するに当たり、上階の外壁パネル40Aにおける胴差し10Aの少なくとも高さ途中レベルで外壁パネル40Aを切断して胴差し10Aの一部を露出させ、切断箇所40aを補強するA工程と、露出した胴差し10Aに対して、天井梁90を接続して増築部200を構築するB工程とを有する。【選択図】図7
Bibliography:Application Number: JP20210060684