DICING BONDING SHEET AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

• Main Authors: ISHII YUTARO, IWAYA WATARU
• Format: Patent
• Language: English; Japanese
• Published: 12.10.2022
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

To provide a dicing die bonding sheet with film adhesive that can suppress residual film adhesive in the support film when picking up a semiconductor chip with film adhesive, and a method for manufacturing semiconductor devices using this sheet.SOLUTION: A dicing die bonding sheet (101) has a support film (11) and a thermosetting film adhesive (13) laminated in direct contact on one side of the support film (11), and the film adhesive (13) of the dicing bonding sheet (101) contains an acrylic resin (a) having carboxy groups.SELECTED DRAWING: Figure 1 【課題】フィルム状接着剤付き半導体チップのピックアップ時に、支持フィルムにおけるフィルム状接着剤の残存を抑制できるフィルム状接着剤を備えたダイシングダイボンディングシート、及び、これを用いた半導体装置の製造方法、の提供。【解決手段】支持フィルム（１１）と、前記支持フィルム（１１）の一方の面上に直接接触して積層された熱硬化性のフィルム状接着剤（１３）と、を備えるダイシングダイボンディングシート（１０１）であって、前記フィルム状接着剤（１３）は、カルボキシ基を有するアクリル樹脂（ａ）を含有するダイシングダイボンディングシート（１０１）。【選択図】図１