POLISHING DEVICE

• Main Authors: HAN JAE KWANG, MORIYA MUNEYUKI, INOUE YUKI, SUZUKI TAKAMASA
• Format: Patent
• Language: English; Japanese
• Published: 12.10.2022
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

To remove slurry adhering to an outer periphery of a holding surface while suppressing deterioration in uniformity of a height of the holding surface.SOLUTION: A polishing device includes: a chuck table having a holding surface capable of sucking and holding a wafer; a rotation mechanism for rotatin...