POLISHING DEVICE

To remove slurry adhering to an outer periphery of a holding surface while suppressing deterioration in uniformity of a height of the holding surface.SOLUTION: A polishing device includes: a chuck table having a holding surface capable of sucking and holding a wafer; a rotation mechanism for rotatin...

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Bibliographic Details
Main Authors HAN JAE KWANG, MORIYA MUNEYUKI, INOUE YUKI, SUZUKI TAKAMASA
Format Patent
LanguageEnglish
Japanese
Published 12.10.2022
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:To remove slurry adhering to an outer periphery of a holding surface while suppressing deterioration in uniformity of a height of the holding surface.SOLUTION: A polishing device includes: a chuck table having a holding surface capable of sucking and holding a wafer; a rotation mechanism for rotating the chuck table around a prescribed rotation axis; a polishing unit having a spindle, and attached with a polishing pad for polishing the wafer sucked and held on the holding surface in the lower end part of the spindle; a slurry supply unit for supplying slurry to at least one of the wafer sucked and held on the holding surface and the polishing pad; and a cleaning unit for cleaning the holding surface. The cleaning unit has a cleaning grindstone coming in contact with the holding surface and removing slurry adhering to the holding surface, and a positioning unit for positioning the cleaning grindstone in a cleaning position where the cleaning grindstone contacts the holding surface, and a retreat position where the cleaning grindstone is separated from the holding surface. A hardness of the cleaning grindstone is lower than a hardness of the holding surface.SELECTED DRAWING: Figure 1 【課題】保持面の高さの均一性の低下を抑制しつつ、保持面の外周部に付着したスラリーを除去する。【解決手段】ウェーハを吸引保持可能な保持面を有するチャックテーブルと、チャックテーブルを所定の回転軸の周りに回転させる回転機構と、スピンドルを有し、保持面で吸引保持されるウェーハを研磨するための研磨パッドがスピンドルの下端部に装着される研磨ユニットと、保持面で吸引保持されたウェーハ及び研磨パッドの少なくとも一方にスラリーを供給するスラリー供給ユニットと、保持面を洗浄する洗浄ユニットと、を備え、洗浄ユニットは、保持面に接触して、保持面に付着したスラリーを除去するための洗浄砥石と、洗浄砥石が保持面に接触する洗浄位置と、洗浄砥石が保持面から離れた退避位置とに、洗浄砥石を位置付ける位置付けユニットと、を有し、洗浄砥石の硬度は、保持面の硬度よりも低い研磨装置を提供する。【選択図】図１
Bibliography:Application Number: JP20210054661