POLYIMIDE PRECURSOR SOLUTION, METHOD FOR PRODUCING POROUS POLYIMIDE FILM, AND POROUS POLYIMIDE FILM

• Main Authors: NAKADA KOSUKE, SEITOKU SHIGERU, SUGAHARA HAJIME, YOSHIDA SATOSHI, HIROSE EIICHI, YOSHIMURA KOSAKU
• Format: Patent
• Language: English; Japanese
• Published: 07.10.2022
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

To provide a polyimide precursor solution that can give a polyimide film having a low resistance.SOLUTION: A polyimide precursor solution contains: a polyimide precursor; particles; and an aqueous solvent containing an amine compound (A), an organic solvent (B) other than the amine compound (A) and water, in which a boiling point of the organic solvent (B) is higher than a boiling point of the amine compound (A), and the boiling point of the organic solvent (B) is 200°C or higher and 300°C or lower.SELECTED DRAWING: None 【課題】抵抗値が低いポリイミドフィルムが得られるポリイミド前駆体溶液の提供。【解決手段】ポリイミド前駆体と、粒子と、アミン化合物（Ａ）、前記アミン化合物（Ａ）及びアミド化合物以外の有機溶剤（Ｂ）及び水を含む水性溶剤と、を含有し、前記有機溶剤（Ｂ）の沸点が前記アミン化合物（Ａ）の沸点より高く、かつ前記有機溶剤（Ｂ）の沸点が２００℃以上３００℃以下であるポリイミド前駆体溶液。【選択図】なし