POLYIMIDE PRECURSOR SOLUTION, METHOD FOR PRODUCING POROUS POLYIMIDE FILM, AND POROUS POLYIMIDE FILM
To provide a polyimide precursor solution that can give a polyimide film having a low resistance.SOLUTION: A polyimide precursor solution contains: a polyimide precursor; particles; and an aqueous solvent containing an amine compound (A), an organic solvent (B) other than the amine compound (A) and...
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Main Authors | , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
07.10.2022
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a polyimide precursor solution that can give a polyimide film having a low resistance.SOLUTION: A polyimide precursor solution contains: a polyimide precursor; particles; and an aqueous solvent containing an amine compound (A), an organic solvent (B) other than the amine compound (A) and water, in which a boiling point of the organic solvent (B) is higher than a boiling point of the amine compound (A), and the boiling point of the organic solvent (B) is 200°C or higher and 300°C or lower.SELECTED DRAWING: None
【課題】抵抗値が低いポリイミドフィルムが得られるポリイミド前駆体溶液の提供。【解決手段】ポリイミド前駆体と、粒子と、アミン化合物(A)、前記アミン化合物(A)及びアミド化合物以外の有機溶剤(B)及び水を含む水性溶剤と、を含有し、前記有機溶剤(B)の沸点が前記アミン化合物(A)の沸点より高く、かつ前記有機溶剤(B)の沸点が200℃以上300℃以下であるポリイミド前駆体溶液。【選択図】なし |
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Bibliography: | Application Number: JP20210186558 |