ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE

To provide an electrostatic chuck with further improved heat uniformity.SOLUTION: An electrostatic chuck has a substrate having a placing surface on which an object to be sucked is placed, an insulating layer formed on the back side of the substrate, which is located on the opposite side of the plac...

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Bibliographic Details
Main Authors MURAMATSU YUSUKE, TAKEMOTO KEIICHI, HARAYAMA YOICHI
Format Patent
LanguageEnglish
Japanese
Published 06.10.2022
Subjects
BASIC ELECTRIC ELEMENTS
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
SEMICONDUCTOR DEVICES
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Summary:To provide an electrostatic chuck with further improved heat uniformity.SOLUTION: An electrostatic chuck has a substrate having a placing surface on which an object to be sucked is placed, an insulating layer formed on the back side of the substrate, which is located on the opposite side of the placing surface, a heating body embedded in the insulating layer, and a heat diffusion layer embedded in the substrate. The heat diffusion layer is formed from a material having a higher thermal conductivity than the substrate.SELECTED DRAWING: Figure 1 【課題】均熱性をさらに向上した静電チャックを提供する。【解決手段】本静電チャックは、吸着対象物が載置される載置面を有する基体と、前記基体の前記載置面とは反対側に位置する裏面に形成された絶縁層と、前記絶縁層に内蔵された発熱体と、前記基体に内蔵された熱拡散層と、を有し、前記熱拡散層は、前記基体よりも熱伝導率の高い材料から形成されている。【選択図】図１
Bibliography:Application Number: JP20210050503