ENCLOSURE FOR ELECTRONIC EQUIPMENT

• Main Authors: SAKO HIROYUKI, KOMIYA TOMONORI, OKUNO TOMOYA, ZHENG WANG, KAWASHIMA YOSHIHIDE
• Format: Patent
• Language: English; Japanese
• Published: 06.10.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

To provide an enclosure for electronic equipment capable of efficiently conducting generated heat to the outside.SOLUTION: An enclosure for electronic equipment includes: a main body part that encloses electronic devices that generate heat due to the drive; and a back face member that is provided on a back face side of the main body part and connected to a rail member. The back face member has a contact surface portion configured to extend inside the main body part to be in direct or indirect contact with a surface of the electronic devices installed inside the main body part. The back face member is composed of a material with higher thermal conductivity than a member for installing the electronic equipment.SELECTED DRAWING: Figure 1 【課題】効率的に発生した熱を外部へ伝導する電子機器用筐体を提供する。【解決手段】電子機器用筐体は、駆動により熱を発する電子機器を収容する本体部と、前記本体部の背面側に設けられ、レール部材に接続される背面部材とを備え、前記背面部材は、前記本体部の内部に設置される前記電子機器の表面と対向して直接的または間接的に接触するように、前記本体部の内部に延伸して構成された接触面部を備え、前記背面部材は、前記電子機器を設置するための部材よりも高熱伝導率の材料により構成される。【選択図】図１