SUBSTRATE PROCESSING DEVICE AND SUBSTRATE LIFTING DEVICE

• Main Author: WANG ZHIDA
• Format: Patent
• Language: English; Japanese
• Published: 06.10.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a lift pin mechanism capable of switching substrate support without increasing the number of through holes provided in a substrate support member.SOLUTION: A substrate processing device includes: a plurality of first lift pins formed in a cylindrical shape with the vertical direction regarded as an axial direction; a plurality of second lift pins formed in a cylindrical or rod shape with the vertical direction regarded as an axial direction, and inserted through the first lift pins respectively; and a lifting mechanism that lifts and lowers the first lift pin and the second lift pin. The lifting mechanism switches a first state in which the upper end of the first lift pin rises to a first height and the upper end of the second lift pin is positioned below the upper end of the first lift pin, and a second state in which the upper end of the second lift pin rises to a second height and the upper end of the first lift pin is positioned below the upper end of the second lift pin.SELECTED DRAWING: Figure 5 【課題】基板支持部材に設けられる貫通孔の数を増やすことなく、基板支持の切り替えを実現可能なリフトピン機構を提供する。【解決手段】本発明に係る基板処理装置は、上下方向を軸方向とする筒状に形成された複数の第１リフトピンと、上下方向を軸方向とする筒状または棒状に形成され、第１リフトピン各々の内部に挿通された複数の第２リフトピンと、第１リフトピンおよび第２リフトピンを昇降させる昇降機構とを備える。昇降機構は、第１リフトピンの上端が第１高さまで上昇し第２リフトピンの上端が第１リフトピンの上端よりも下方に位置する第１状態と、第２リフトピンの上端が第２高さまで上昇し第１リフトピンの上端が第２リフトピンの上端よりも下方に位置する第２状態とを切り替える。【選択図】図５