FILTER AND HIGH FREQUENCY DEVICE
To enlarge a coupling coefficient between resonators.SOLUTION: A filter comprises: a first dielectric layer 12d; a second dielectric layer 12e; a first conductive layer 14d provided on the side opposite to the second dielectric layer with respect to the first dielectric layer; a plurality of first c...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
05.10.2022
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Subjects | |
Online Access | Get full text |
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Summary: | To enlarge a coupling coefficient between resonators.SOLUTION: A filter comprises: a first dielectric layer 12d; a second dielectric layer 12e; a first conductive layer 14d provided on the side opposite to the second dielectric layer with respect to the first dielectric layer; a plurality of first conductor posts 16d penetrating the first dielectric layer; a first space 11b having a first center 50b so as to be surrounded by the plurality of first conductor posts; a second conductive layer 14f provided on the side opposite to the first dielectric layer with respect to the second dielectric layer so as to be contacted to the second dielectric layer; a conductor post 16e penetrating the second dielectric layer; a second space 11c having a second center 50c surrounded by a plurality of second conductor posts; and a third conductive layer 14e provided on both sides at the first and second centers in a plan view, having a pair of openings 18e which are not overlapped with the first and second centers, provided between the first dielectric layer and the second dielectric layer, and contacted to the first dielectric layer and the second dielectric layer.SELECTED DRAWING: Figure 5
【課題】共振器間の結合係数を大きくすること。【解決手段】フィルタは、第1誘電体層12dと、第2誘電体層12eと、第1誘電体層に対し第2誘電体層と反対側に設けられた第1導電体層14dと、第1誘電体層を貫通する複数の第1導電体ポスト16dと、複数の第1導電体ポストに囲まれ第1中心50bを有する第1空間11bと、第2誘電体層に対し第1誘電体層と反対側に設けられ、第2誘電体層に接する第2導電体層14fと、第2誘電体層を貫通する導電体ポスト16eと、複数の第2導電体ポストに囲まれた第2中心50cを有する第2空間11cと、平面視において第1中心および第2中心の両側に設けられ、第1中心および第2中心に重ならない一対の開口18eを有し、第1誘電体層と第2誘電体層との間に設けられ、第1誘電体層および第2誘電体層に接する第3導電体層14eとを備える。【選択図】図5 |
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Bibliography: | Application Number: JP20210047459 |