DEVICE MODULE

To provide a technology that can cool a device without housing the device in a duct.SOLUTION: A device module 20 includes: a support member 30 disposed in a roof internal space between a roof panel 12 and an interior member 16 in a vehicle 10; and a device 50 supported by a support surface 32 of an...

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Bibliographic Details
Main Authors TANIGUCHI TAKUYA, SATO TATSUMI, TAKEHISA AI, SONE KOSUKE, YAMAMOTO YASUYUKI
Format Patent
LanguageEnglish
Japanese
Published 29.09.2022
Subjects
ARRANGEMENTS OR ADAPTATIONS OF HEATING, COOLING, VENTILATING,OR OTHER AIR-TREATING DEVICES SPECIALLY FOR PASSENGER OR GOODSSPACES OF VEHICLES
PERFORMING OPERATIONS
TRANSPORTING
VEHICLES IN GENERAL
VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISEPROVIDED FOR
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Summary:To provide a technology that can cool a device without housing the device in a duct.SOLUTION: A device module 20 includes: a support member 30 disposed in a roof internal space between a roof panel 12 and an interior member 16 in a vehicle 10; and a device 50 supported by a support surface 32 of an outer surface of the support member 30. A support member side passage 36 is formed within the support member 30. The support member side passage 36 is connected to a duct side passage 18 of a duct 17 in the vehicle 10.SELECTED DRAWING: Figure 2 【課題】機器がダクト内に収容されずとも、機器を冷却可能な技術を提供することを目的とする。【解決手段】機器モジュール２０は、車両１０においてルーフパネル１２と内装部材１６との間のルーフ内空間に配置される支持部材３０と、前記支持部材３０の外面のうち支持面３２に支持された機器５０と、を備える。前記支持部材３０の内部には、支持部材側流路３６が形成され、前記支持部材側流路３６は、車両１０におけるダクト１７のダクト側流路１８と接続される。【選択図】図２
Bibliography:Application Number: JP20210041749