SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

To provide a semiconductor device capable of securing a proof pressure while suppressing increase of a chip size.SOLUTION: A semiconductor device comprises: a semiconductor layer 1 of a first conductivity type; a well region 2 of a second conductivity type, provided onto an upper part of the semicon...

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Bibliographic Details
Main Authors TAKAGIWA KAZUMI, SUMIDA HITOSHI
Format Patent
LanguageEnglish
Japanese
Published 21.09.2022
Subjects
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