PRINTED CIRCUIT BOARD AND OPTICAL TRANSCEIVER

To reduce unnecessary electromagnetic waves.SOLUTION: A printed circuit board 10 has: a conductor plate 30 provided below an inner dielectric layer 28; vias 32 penetrating through the inner dielectric layer 28, bonded with the conductor plate 30, and centered at points P on an upper surface of the c...

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Bibliographic Details
Main Author KAGAYA OSAMU
Format Patent
LanguageEnglish
Japanese
Published 07.09.2022
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
TRANSMISSION
WAVEGUIDES
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Summary:To reduce unnecessary electromagnetic waves.SOLUTION: A printed circuit board 10 has: a conductor plate 30 provided below an inner dielectric layer 28; vias 32 penetrating through the inner dielectric layer 28, bonded with the conductor plate 30, and centered at points P on an upper surface of the conductor plate 30, respectively; a ground conductor 24 provided above the inner dielectric layer 28, bonded with the vias 32, and expanded outward from any quadrilateral Q whose vertices are the closest four points P of the points P; an electromagnetic resonance plate 34 provided above the inner dielectric layer 28 and inside the quadrilateral Q, and being electrically connected with the ground conductor 24 and the vias 32 at a portion other than a convex outer edge 36 serving as a junction 38; an upper dielectric layer 18 provided above the electromagnetic resonance plate 34; and a differential transmission line 12 provided above the upper dielectric layer 18, and configured by a pair of strip conductors 14 overlapped with the electromagnetic resonance plate 34. The conductor plate 30 and the vias 32 configure an electromagnetic field confinement structure.SELECTED DRAWING: Figure 1 【課題】不要電磁波の低減を目的とする。【解決手段】プリント回路基板１０は、内部誘電体層２８の下方にある導体板３０と、内部誘電体層２８を貫通し、導体板３０に接合し、導体板３０の上面の点Ｐに中心がそれぞれ位置するビア３２と、内部誘電体層２８の上方で、ビア３２に接合し、点Ｐの最も近い４つの点Ｐを頂点とするいずれの四角形Ｑからも外側に拡がる接地導体２４と、内部誘電体層２８の上方で、四角形Ｑの内側にあって、凸状外縁３６を除いた部分が接合部３８となって、接地導体２４およびビア３２と電気的に接続されている電磁共振板３４と、電磁共振板３４の上方にある上誘電体層１８と、上誘電体層１８の上方にあって、電磁共振板３４と重なる一対のストリップ導体１４から構成される差動伝送線路１２と、を有する。導体板３０およびビア３２は、電磁界閉じ込め構造を構成する。【選択図】図１
Bibliography:Application Number: JP20210030323