ORGANIC EL PANEL SUPPORT SYSTEM

To provide an organic EL panel support system which dispenses with a wiring space and a surplus member for fixation, and can sufficiently derive a thin thickness inhering in an organic EL panel.SOLUTION: An organic EL panel support system comprises: an organic EL panel part 10 having an organic EL p...

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Bibliographic Details
Main Author ISHIDA SEIJI
Format Patent
LanguageEnglish
Japanese
Published 06.09.2022
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Summary:To provide an organic EL panel support system which dispenses with a wiring space and a surplus member for fixation, and can sufficiently derive a thin thickness inhering in an organic EL panel.SOLUTION: An organic EL panel support system comprises: an organic EL panel part 10 having an organic EL panel 1, a first ferromagnetic metal plate 2, and a second ferromagnetic metal plate 3, and a common wire 4 for electrically connecting the first ferromagnetic metal plate 2, the second ferromagnetic metal plate 3, and an external connection terminal of the organic EL panel; and an organic EL panel support part 13 including a connection part 11 having a first conductive magnet 6 and a second conductive magnet 7 electrically connected to the first ferromagnetic metal plate 2 and the second ferromagnetic metal plate 3 respectively, and magnetically adhering thereto, and an insulation member 8 for connecting the first conductive magnet 6 and the second conductive magnet 7, and a support member 12 including an external connection line 9 electrically connected to the first conductive magnet and the second conductive magnet, and supporting the connection part.SELECTED DRAWING: Figure 2 【課題】結線スペース及び固定のための余分な部材が無くなり、有機ELパネルが本来もつ薄さを十分引き出すことができる有機ELパネル支持システムを提供する。【解決手段】有機ELパネル支持システムは、有機ELパネル1と、第1の強磁性金属板2及び第2の強磁性金属板3と、第1の強磁性金属板2及び第2の強磁性金属板3と有機ELパネルの外部接続端子とをそれぞれ電気的に接続する通線4とを有する有機ELパネル部10及び第1の強磁性金属板2及び第2の強磁性金属板3にそれぞれ電気接続するとともに磁気的に固着する第1の導電性磁石6及び第2の導電性磁石7と、第1の導電性磁石6及び第2の導電性磁石7を結合する絶縁部材8を有する接続部11と、第1の導電性磁石及び第2の導電性磁石にそれぞれ電気的に接続する外部接続線9を含み、接続部を支持する支持部材12とを有する有機ELパネル支持部13と、を備えている。【選択図】図2
Bibliography:Application Number: JP20210029234