GRINDING METHOD AND GRINDING DEVICE

• Main Authors: BANDO TSUBASA, MITSUI TAKAHIKO, HONDA YU, YAMAMOTO EIICHI
• Format: Patent
• Language: English; Japanese
• Published: 31.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

To provide a grinding method and a grinding device which can highly accurately grind a substrate in which a dissimilar material part is embedded in a short time.SOLUTION: A grinding method for rotating a substrate 40 in which a dissimilar material part 42 made of a material different from a main component is embedded, and grinding the substrate 40 with a grinding wheel 3 while rotating and downward feeding the grinding wheel 3, comprises the steps of: continuously imaging a processing surface of a substrate 30 with an image sensor 10 during grinding; analyzing an exposure amount of the dissimilar material part 42 from the image data obtained by the image sensor 10; and continuously executing the grinding to a stage where the exposure amount of the dissimilar material part 42 reaches a prescribed set value from the state where the dissimilar material part 42 starts to be exposed. With this configuration, the grinding state can be correctly grasped without repeating execution and stop of the grinding in order to detect the exposure of the dissimilar material part 42 like a conventional technique. Consequently, the substrate 40 in which the dissimilar material part 42 is embedded can be efficiently and highly accurately ground in a short time.SELECTED DRAWING: Figure 1 【課題】異種材料部が埋め込まれた基板を短時間で高精度に研削することができる研削方法及び研削装置を提供する。【解決手段】主たる構成材料とは異なる材料から成る異種材料部４２が埋め込まれた基板４０を回転させ、且つ研削といし３を回転させながらダウンフィードさせて基板４０を研削といし３で研削加工する研削方法であって、研削加工中に基板３０の加工面を画像センサ１０で連続的に撮像し、画像センサ１０によって得られた画像データから異種材料部４２の露出量を解析し、異種材料部４２が露出し始めた状態から異種材料部４２の露出量が所定の設定値に達する段階まで研削加工を継続して実行する。これにより、従来技術のように異種材料部４２の露出を検知するために研削加工の実行及び停止を繰り返すことなく、研削状況を正確に把握することができる。よって、異種材料部４２が埋め込まれた基板４０を短時間で効率良く高精度に研削することができる。【選択図】図１