SEMICONDUCTOR MEMORY DEVICE
To provide a semiconductor memory device with easy formation of step sections.SOLUTION: A semiconductor memory device 10 has a stacking section 100 in which a plurality of conductor layers 40 are stacked along the z-direction and a step section 200 in which a plurality of conductor layers 40 are dra...
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Main Authors | , , , |
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Format | Patent |
Language | English Japanese |
Published |
30.08.2022
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a semiconductor memory device with easy formation of step sections.SOLUTION: A semiconductor memory device 10 has a stacking section 100 in which a plurality of conductor layers 40 are stacked along the z-direction and a step section 200 in which a plurality of conductor layers 40 are drawn in a staircase-like manner along the y-direction. The step section 200 includes a lower step section 220 and an upper step section 210. In the upper step section 210, the conductor layer 40 is formed so that the conductor layer extends longer toward one side along the y direction as it goes toward the lower step section 220 along the z direction. The lower step section 220 is formed at a position that is opposite to the above one side along the y direction than the upper step section 210.SELECTED DRAWING: Figure 2
【課題】階段部の形成が容易な半導体記憶装置を提供する。【解決手段】半導体記憶装置10は、複数の導電体層40がz方向に沿って積層されている積層部100と、複数の導電体層40がy方向に沿って階段状に引き出されている階段部200と、を備える。階段部200には、下側階段部220と上側階段部210とが含まれている。上側階段部210では、z方向に沿って下側階段部220側に行く程、導電体層40がy方向に沿った一方側へと向かって長く伸びるように形成されている。下側階段部220は、上側階段部210よりも、y方向に沿って上記の一方側とは反対側となる位置に形成されている。【選択図】図2 |
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Bibliography: | Application Number: JP20210024335 |