INORGANIC FILLER POWDER, THERMALLY CONDUCTIVE POLYMER COMPOSITION, AND METHOD OF PRODUCING INORGANIC FILLER POWDER

• Main Authors: NAGIRA TSUMORU, NISHIYAMA MASAFUMI
• Format: Patent
• Language: English; Japanese
• Published: 30.08.2022
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM,CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THERARE-EARTH METALS; INORGANIC CHEMISTRY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide inorganic filler powder capable of yielding a thermally conductive polymer composition of excellent heat conductivity and low hardness at a low cost, a thermally conductive polymer composition using the same, and a method of producing the inorganic filler powder.SOLUTION: The inorganic filler powder structured in such a manner that at least a part of a surface of an inorganic particle having a particle size of 1 μm or more is covered with an inorganic fine particle having a particle size of 10 nm or more and smaller than 0.1 μm, is characterized in that a coverage rate of the surface of the inorganic particle covered with the fine inorganic particle is 30% or more.SELECTED DRAWING: Figure 1 【課題】熱伝導性に優れ、かつ硬さが低い熱伝導性高分子組成物を低コストに得ることが可能な無機フィラー粉末、およびこれを用いた熱伝導性高分子組成物、また、無機フィラー粉末の製造方法を提供する。【解決手段】粒径が１μｍ以上の無機粒子の表面の少なくとも一部を、粒径が１０ｎｍ以上、０．１μｍ未満の無機微粒子で被覆した構造であり、前記無機微粒子による前記無機粒子の表面の被覆率が３０％以上であることを特徴とする。【選択図】図１