PROCESSING METHOD AND PROCESSING DEVICE

• Main Author: IKEGAMI KAZUYA
• Format: Patent
• Language: English; Japanese
• Published: 29.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING

To properly control the thickness and flatness of a ground substrate.SOLUTION: A processing method of a substrate is provided, including: grinding a substrate; obtaining the thickness and thickness distribution of the one ground substrate; and grinding another substrate on the basis of the obtained...