PROCESSING METHOD AND PROCESSING DEVICE

• Main Author: IKEGAMI KAZUYA
• Format: Patent
• Language: English; Japanese
• Published: 29.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING

To properly control the thickness and flatness of a ground substrate.SOLUTION: A processing method of a substrate is provided, including: grinding a substrate; obtaining the thickness and thickness distribution of the one ground substrate; and grinding another substrate on the basis of the obtained thickness and thickness distribution, and when the other substrate is ground, the amount of grinding of the other substrate is adjusted on the basis of difference between the target thickness of the one substrate and the thickness of the one ground substrate, and a relative tilt between a holding mechanism that holds the substrate and a grinding mechanism that grinds the substrate is adjusted on the basis of the thickness distribution of the one ground substrate.SELECTED DRAWING: Figure 8 【課題】研削処理後の基板厚み及び平坦度を適切に制御する。【解決手段】基板の処理方法であって、一の基板を研削することと、研削後の前記一の基板の厚み及び厚み分布を取得することと、取得された厚み及び厚み分布に基づいて他の基板を研削することと、を含み、前記他の基板の研削に際しては、前記一の基板の目標厚みと前記一の基板の研削後の厚みとの差分に基づいて、前記他の基板の研削量を調整するとともに、前記一の基板の研削後の厚み分布に基づいて、前記基板を保持する保持機構と、前記基板を研削する研削機構との相対的な傾きを調整する。【選択図】図８