EXPOSURE APPARATUS AND METHOD FOR MANUFACTURING ARTICLE
To provide a technique advantageous on the point of forming accuracy of a pattern onto a substrate in scanning exposure.SOLUTION: An exposure apparatus that performs scanning exposure of a shot region of a substrate by scanning the substrate with respect to exposure light, comprises: a measurement p...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | English Japanese |
Published |
29.08.2022
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | To provide a technique advantageous on the point of forming accuracy of a pattern onto a substrate in scanning exposure.SOLUTION: An exposure apparatus that performs scanning exposure of a shot region of a substrate by scanning the substrate with respect to exposure light, comprises: a measurement part which measures a surface position of the shot region in prior to exposure of the shot region within a measurement visual field by the exposure light during the scanning exposure; and a control part which performs focus-leveling control of the substrate on the basis of a measurement result of the measurement part in an overlapping part between the measurement visual field and the shot region during the scanning exposure, where the control part determines a parameter value for limiting the drive of the substrate in the focus-leveling control on the basis of information showing the size of the overlapping part.SELECTED DRAWING: Figure 1
【課題】走査露光における基板上へのパターンの形成精度の点で有利な技術を提供する。【解決手段】露光光に対して基板を走査することにより前記基板のショット領域の走査露光を行う露光装置は、前記走査露光中、前記露光光による前記ショット領域の露光に先立って、計測視野内で前記ショット領域の表面位置を計測する計測部と、前記走査露光中、前記計測視野と前記ショット領域との重複部分における前記計測部の計測結果に基づいて、前記基板のフォーカス・レベリング制御を行う制御部と、を備え、前記制御部は、前記重複部分の大きさを示す情報に基づいて、前記フォーカス・レベリング制御における前記基板の駆動を制限するためのパラメータ値を決定する。【選択図】図1 |
---|---|
Bibliography: | Application Number: JP20210023689 |