LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE, LIGHT SOURCE DEVICE, AND LAMP

• Main Authors: KANBARA DAIZO, SHIBUSAWA SOICHI
• Format: Patent
• Language: English; Japanese
• Published: 26.08.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To provide a light-emitting device that has high-precision and long-life, suppresses positional misalignment and optical axis misalignment between a light-emitting element and an optical element, has high-precision light distribution characteristics, and has high lens adhesion against temperature changes, a manufacturing method of the light-emitting device, a light source device, and a lamp.SOLUTION: A light-emitting device includes a substrate 12 having a circuit wiring, a semiconductor light emitting element 15 mounted on the substrate, a frame 21 erected in an annular or oval shape on the substrate so as to surround the semiconductor light emitting element, and a sealing portion 23 that seals the inner wall of the frame, the upper surface of the substrate inside the frame, and the semiconductor light emitting element. The sealing portion includes a first resin portion 23A having a concave surface composed of at least one surface of rotation about the central axis of the frame, and a second resin portion 23B provided to cover the concave surface of the first resin portion and having a convex outer surface, and has an outer surface in which the outer surface of the first resin portion and the outer surface of the second resin portion are integrated.SELECTED DRAWING: Figure 3 【課題】発光素子と光学要素との位置ずれ及び光軸ずれが抑制され、高精度の配光特性を有し、また、温度変化に対してもレンズの密着性が高く、高精度で長寿命の発光装置、発光装置の製造方法、光源装置及び灯具を提供する。【解決手段】回路配線を有する基板１２と、基板上に実装された半導体発光素子１５と、半導体発光素子を囲むように基板上に円環状又は長円環状に立設された枠体２１と、枠体の内壁、枠体の内側の基板の上面及び半導体発光素子を封止する封止部２３と、を備えている。封止部は、枠体の中心軸を回転軸とする少なくとも１つの回転面からなる凹状の表面を有する第１の樹脂部２３Ａと、第１の樹脂部の凹状の表面を覆って設けられるとともに、凸状の外表面を有する第２の樹脂部２３Ｂを有し、第１の樹脂部の外表面と第２の樹脂部の外表面とが一体化した外表面を有する。【選択図】図３